Precision Wire Saws

Precision Wire Saws

Precision wire saws available from Princeton Scientific have been developed with an improved cutting technique that utilizes the precision guidance of the with and uniform application of an abrasive slurry. This results in:

  • Surface quality is almost 'lapped' quality
  • Cutting that does not introduce deformations (eliminate the part "or defects")
  • Minimal loss of material from cutting
  • Wire diameters from 20µm. to 60µm
  • No "wandering" of cutting wire into an unintended direction.

These precision wire saws are ideal for the precise cutting of:

  • Semiconductors
  • Ferrites
  • Metals
  • Glasses
  • Other Hard or Brittle Solids

A variety of Precision wire saws are available that can cut samples to down to a thickness of 10μm, with smooth cut surfaces where the roughness does not exceed 1µm.

A goniometer can be mounted right to the saw, thereby allowing for very precise orientations or crystal surfaces before the cutting process.


See below for various precision wire saw sizes, configuration and accessories.



WS-22 Precision Wire Saw

Material Science & Engineering

Precision wire saw for cutting small samples. Maximal sample dimensions: 40x40mm. The saw can be used for precision cutting of semiconductors, ferrites, metals, glasses, minerals as well as many other hard or brittle solids.

WS-22B Precision Wire Saw

Particle Beam Line Diagnostic

Precision wire saw for cutting small and medium size samples. Maximal sample dimensions: 80x80x150mm. The saw can be used for precision cutting of semiconductors, ferrites, metals, glasses, minerals as well as many other hard or brittle solids.

WS-25 Precision Wire Saw

NEW

Wire Saws

WS-25 is our fist saw that can cut using free abrasive method or cutting with diamond dotted wire. Saw is equipped with electronically controlled support which allows cutting in straight line without the use of wire posts. Field of application is the same as for WS-22 and WS-22B saw.

MS-80 Multi Band Saw

Particle Beam Line Diagnostic

The MS80 Multi Band Saw is a precision device for cutting or slicing hard and brittle materials. Saw enables cutting of very thin slices (thickness of 50um) with smooth cut surfaces.

Additional Equipment

Wire Saws

We offer additional equipment for our wire saws, including:

  • Goniometers
  • Laue Cameras
  • Vacuum Sample Holders
  • Optical Orientation Devices
  • Stereomicroscopes

Wire Saw Resources

Material Science & Engineering

Additional resources for our Wire Saw products including PDFs and videos.

 

Products